Post-Processing Your Metallized Substrates:

Your ceramic substrates can be laser processed after they have been metallized using our state-of-the-art systems.

Through the use of closed-circuit cameras mounted parallel to the laser cutting head, we can accurately align to pre-metallized fiducial marks, or pre-established 0,0 datum points, to precisely cut the ceramic substrate relative to your metallized pattern. This allows the substrate to be final cut after metallization, which is often preferred for more complex circuit designs.

This process can also help to eliminate costly handling issues during the print and fire process of a thick film hybrid circuit.

Laser Processing Specifications
Laser Processing Advantages