Our
seamless precision results in plug-free vias, improved
yields, and your complete satisfaction.
Laser
scribing is used to etch lines into a material. The most common
application is to create "snapstrates" by perforating
a substrate into multiple segments so it can be snapped into
individual small substrates after thick or thin film metalization.
The scribed
lines can be as thin as 0.005"-0.006", can be set
to an exact depth, and can be as little as 0.005"-0.006"
apart.
