Laser Specifications guide

Please contact us for a free printed copy of this guide for your convenience.

Drawing files for your orders can be sent here, and we can convert them from DXF, ASCII, CAD, IGES, AutoCad or other formats.

General Laser Specifications
Scribing Tolerances
Drilling Tolerances
Machining Tolerances
Cosmetics

General Laser Specifications

Quality System

• The quality system conforms to Mil-Std I-45208A and  is ISO 9002 compliant.
• Inspection system conforms to Mil-Std 105E - General Inspection Level II, 2.5% AQL used on final inspection audit unless otherwise specified or not requested by customer.
• Statistical process control (SPC) data is available upon request.
• Unless otherwise specified, all drawings shall be interpreted as being front view. All laser processing work will take place on the front side.
• All ceramic is purchased per Lasereliance Technologies specification LRTS-001.
• Lasereliance does not warrant the total cleanliness of the product. For best results, Lasereliance recommends the customer clean-fire the parts prior to processing.

Packaging

• Standard packaging requirements shall conform to Lasereliance Technologies specifications.
• Packaging other than standard should be noted on purchase order. Other special services are available upon request; i.e., labeling requirements, special shipping instructions, etc.
  

Reli-Cote™

• Lasereliance normally protects the ceramic surface from laser-induced dust and debris by an application of a polymer protective coating. This protection is provided by treatment of Reli-Cote^TM prior to laser processing.
• After laser processing, the ceramic parts are cleaned with tap water and then drip-dried in a drying cabinet prior to packaging and shipment.

Customer Supplied Material

• Lasereliance's normal processing yield is greater than 90%. Lasereliance warrants products manufactured and/or services performed on customer supplied material to be free of defects in workmanship. Lasereliance accepts no liability for customer supplied materials. All credits issued will only be for the amount of laser services and/or products invoiced. No credits will be given for tooling, fixturing, customer supplied materials, or other services provided.
• Customer shall provide Lasereliance with a reasonable amount of extra material for set up and normal yield factors.
  

Returned Goods

• All returned goods must have a Return Material Authorization (RMA) number assigned first by the Quality Manager of LRT.
• The RMA number must be clearly marked on the packaging or it may be refused by our receiving department.
• Claims for shortage, damage, defects in material and/or workmanship must be made within 30 days of receipt.

return to top

Scribing Tolerances

• As fired ceramic thickness range ±10% using a micrometer.
• Scribe depth minimum 0.003" to a maximum of 0.030" ±0.002" verified by calibrated microscope.
• Breakout tolerance using vernier calipers or height gauge for thicknesses:
  • 0.010" to 0.030" ±0.005"
  • 0.031" to 0.060" ±0.010"
• Breakout tolerance to machine line using an optical comparator or vision system from thicknesses:
  • 0.010" to 0.030" ±0.0035"
  • 0.031" to 0.060" ±0.006"

Location:

Scribe Line To Scribe Line Fired Edge Center Hole Machine Line Distance Apart Up to 6.0" >6.0" Up to 6.0" >6.0" Up to 6.0" >6.0" Up to 6.0" >6.0" Tolerance ±0.001" ±0.003" ±0.001" ±0.002"

All tolerances determined using an optical comparator or vision system.

* Miscellaneous

* Nominal non-accumulative pulse spacing 0.006" ±0.001" using a microscope or vision system.

* Nominal scribe depth 33% to 50% of substrate thickness using microscope.

* Maximum surface slag height of 0.001" using a microscope.

return to top

2.0 Drilling tolerances

• Smallest hole drilled is 0.004" with maximum HAZ of 0.002" ±0.002" using an optical comparator, microscope, or vision system.
• Hole size using an optical comparator, vision system or gauge pins for thicknesses:
  • Between 0.010" to 0.035" +0.002"
  • Between 0.036" to 0.060" +0.003"
• Hole taper using a microscope for thicknesses:
  • Between 0.010" to 0.015" +0.002" -0.000"
  • Between 0.016" to 0.040" +0.003" -0.000"
  • Between 0.041" to 0.060" +0.004" -0.000"

Location:

Hole Center To Hole Center Fired Edge Machine Line Distance Apart Up to 6.0" >6.0" Up to 6.0" >6.0" Up to 6.0" >6.0" Tolerance ±0.001" ±0.003" ±0.001"

All tolerances determined using an optical comparator or vision system.

return to top

Machining Tolerances

3.0 Machining

• Perpendicularity of laser cut walls for thicknesses between 0.010" to 0.060" ±0.002" using an optical comparator.
• Minimum kerf width 0.004" ±0.002" using an optical comparator, vision system, or microscope.
• Minimum radius 0.002" (equivalent to 1/2 of the kerf) ±0.001" using an optical comparator, vision system, or microscope.

Location:

Machined Edge To Machined Edge Fired Edge Distance Apart Up to 6.0" >6.0" Up to 6.0" >6.0" Tolerance ±0.001" ±0.003"

All tolerances determined using an optical comparator or vision system.

4.0 Post Printing Operations

• Minimum street width of 0.010" ± 0.002" between metalized or printed traces.
• Repeatability of 0.001" ± 0.001" from fiducial to laser point using an optical comparator or vision system.

All measurements are from a laser point to a laser point except where noted.

return to top

Cosmetic Quality

Attribute/Test Procedure: Tolerance: Scribe Pulses: Viewed at 5 locations under 10x magnification with rear projection illumination. Plugged pulse marks typically appear black or dark. 90% clean 1 in 10 plugged Scribe Depth:  Ink substrate on clean, scraped part with a black marker. Allow to completely dry. Snap substrate and measure from the entrance side with calibrated microscope. ±0.002” standard Flares: Using vision system or vernier caliper along edge after breakout. Within overall specification limits - see (1.0 Scribing .) Perpendicularity: Reference points taken on laser cut line at entrance and exit side of part. Not to exceed length and width tolerances Holes: Using optical comparator or vision system, read data points in at least three separate locations spaced at approximately 120 degrees or use a precision plug gauge. Free of debris Nominal hole diameter shall be equal to the average of three separate "sets" of measurements Cusp: Determine the ratio between the length (the chord between two points of deviation) and the height (from a line perpendicular to the chord of the apex). Acceptable Ratios: Thickness Range     Ratio 0.010”-0.015”         2:1 0.016”-0.040”         3.1 0.041”-0.060”         4.1 Slot Or Cutout: Use an optical comparator or vision system, usually at exit dimensions. Free of debris On substrates with a thickness >0.025", a "dog-bone" appearance will be acceptable if within specification's tolerance band Chipout: Use side lighting under 30x microscope or vision system. Distance into surface <0.030” Height <50% of substrate thickness Length < length of part Heat Affected Zone (HAZ): Use side lighting under 30x microscope or vision system. ±0.002" on entrance side of laser feature Street Width: Use direct light under 30x microscope or vision system. Width > 0.010" Laser kerf width 0.004”. ±0.002”

return to top